Robocon 2019 ‒ Hong Kong Contest
The Robocon 2019 Hong Kong Contest has the following objectives.
  • 引發公眾(尤其是大學生和中學生)對工程學及資訊科技的興趣,增進認識;
    To arouse the interest in and awareness of engineering and IT among the public, in particular university and secondary school students.
  • 讓大專學生和有志投身工程界的青年動手設計並製作機械人,從中汲取經驗;
    To encourage the design and construction of robots, providing real experience for post-secondary students and future engineers.
  • 為各大學院系設定合作目標,讓機械工程、電子、電腦程式設計學生彼此合作;
    To set a joint project target for various university departments, requiring co-operation between students studying mechanical engineering, electronics and computer programming.
  • 讓本地大專院校交流工程學的心得;
    To serve as a platform for local universities and colleges to exchange experiences in engineering.
  • 選拔優勝者,代表香港參與國際賽事;
    To select the strongest team to represent Hong Kong in the international contest.
  • 透過國際賽事的平台,讓香港學生與其他國家 / 地區的工程系學生交流經驗;
    To provide a valuable chance for local students to exchange engineering experiences with students from other countries/ regions through the international contest.
  • 向世界各國介紹本地大學在工程學方面的成就;
    To provide exposure for local universities on an international stage.
  • 提昇香港高等教育的形象;
    To promote the image of Hong Kong in higher education.
  • 藉電視轉播普及工程知識。
    By means of television coverage, to promote engineering concepts among the public.


Platinum Sponsor
TÜV SÜD Hong Kong Ltd.
Gold Sponsor
ASM Technology Hong Kong Limited TK Group International (Hong Kong) Limited​
Team Fund Sponsor
Asian Robotics League Association Leeport (Holdings) Ltd.
Bronze Sponsor
CLP Power Hong Kong Limited The Hongkong Electric Co., Ltd. IPE Group Limited Long Data Technology Limited Wing & Kwong Steel Engineering Co. Ltd.
In-Kind Sponsor
Arrow Asia Pac Ltd. BDS Technology (HK) Limited GoAnimate Hong Kong Limited Hestia Kitchen The Hong Kong and China Gas Company Limited Karmo International Co. Ltd.

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